Chercheur postdoctoral en microélectronique

sherbrooke university

jobsincanada.one

Titre de projet/ project title: Cuissons alternatifs des encapsulants des puces flip chip / Alternative approaches to curing flip chip underfill encapsulants

Directeur(s) de recherche: David Danovitch

Nom du partenaire / Name
of industrial partner: IBM Canada Ltée
Description:

This project is focussed on photonic packaging improvements. Specifically, we seek to reduce the warpage of ‘Photonic integrated circuits (PIC)’ that are assembled onto these packages in order to optimize the performance and reliability of a multitude of fibers attached thereon. Such warpage is highly dependant on the encapsulant material (underfill) used to reinforce the flip chip interconnections of the PIC as well as its polymerisation (cure) protocol. We propose in this projet a study of alternative underfills and their cure protocols in order to reduce package stresses induced by these materials, thereby reducing PIC warpage. We also seek to investigate novel localised cure technologies to further reduce warpage.
The candidate will be responsible to survey recent materials proposed by leading underfill suppliers and selecting one or more candidates for assembly evaluation. In doing so, the candidate will develop cure protocols, including the study of alternative cure approaches, and will use a number of techniques for polymer and package characterisation.
The candidate will acquire a number of invaluable skills in this project, not only related to microelectronic packaging processes and structures, but also regarding industrial needs and practices, in that much of the research will be conducted in an industrial environment.
The candidate should have a strong interest in pursuing research in the field of microelectronic assembly and polymers (especially epoxy). Previous experience in microlectronic packaging, while not required, would be considered an asset, as would a practical knowledge of polymer characterisation (DSC, rheometry, FTIR, etc.) and assembly characterisation (acoustic microscopy, interferometry, SEM, etc.) techniques.
Finally, the candidate should possess means of transportation, as the majority of the work will take place at the C2MI research facilities in Bromont, Quebec. The target start date of this project is Sep,2022.

Type d’emploi : Temps plein

Salaire : 40 000,00$ à 50 000,00$ par an

Avantages :

  • Bourses d’Études

Flexible Language Requirement :

  • Anglais non requis

Horaires de travail :

  • 8 Heures

Formation:

  • Doctorat (Souhaité)

Date de début prévue : 2022-10-03

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